Yamaha Motor Releases New i-Cube10 (YRH10) Hybrid Placer

Yamaha Motor Europe, SMT Section will release its new i-Cube10 (YRH10) hybrid placer, which has both surface mounter functions for electronic components and a die bonder for wafer components.

The i-Cube10 (YRH10) was developed as the successor to the long-selling i-CubeIID (YHP-2D), known for its space-saving design as well as excellent productivity and versatility with its hybrid placer for device assembly and a wafer feed unit as standard equipment. The new i-Cube10 (YRH10) retains the same high processing compatibility suiting a wide range of electronic components and semiconductor packages, but boasts 50% higher production capability and mounting accuracy, achieving a bare chip mounting speed of 10,800 CPH  from wafer supply and a mounting accuracy of ±15 μm.

Main features include:

1. high-speed productivity by optimizing recognition camera operations for the mounting head and wafers, component recognition via the head-mounted scan camera, the adoption of a 10-unit multi-nozzle mounting head, and accelerated wafer swaps; and improved mounting accuracy by adopting a high-rigidity conveyor, axis control optimization, a heat compensation feature and more,
2. high versatility that allows mounting of surface mount devices (SMD) as well as wafer components with a single unit,
3. user-friendly-focused features such as a wafer pickup condition setup utility that can optically set conditions for wafer parts, a newly developed user interface with improved usability, and a feeder unit capacity twice that of previous models.

More info in original Press Release.