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Dialog Launches TINY Bluetooth® Low Energy SoC and Module

16.12. 2019 | News
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Dialog Semiconductor announced both the new DA14531, the world’s smallest and most power-efficient Bluetooth 5.1 SoC, and the DA14531 module, to simplify Bluetooth product development and enable wider adoption. The chip, also known as SmartBond TINY™, is currently in production.

SmartBond TINY is specifically designed to lower the costs of adding BLE functionality to an application to as little as $0.50 in high volumes, fueling the next wave of the IoT, estimated to span over 1 billion devices. At half the size of its predecessors, SmartBond TINY is available in packages as small as 2.0 x 1.7 mm. Moreover, the SoC’s high level of integration only requires six external passives, a single clock source and a power supply to make a complete Bluetooth low energy system (more info).

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