December 23, 2024 
Professional magazine and portal dedicated to electronics 
The SMTconnect, the only event in Europe that takes a holistic approach to system integration in microelectronics, offers participants a diverse program in Nuremberg from 7 - 9 May 2019.
The EMS Park, with its natural and open design, reminiscent of a park and designed with a focus on networking opportunities, is taking shape. So far, the companies Hekatron Technik GmbH, Hinrichs Elektronik GmbH, TechniSat Digital GmbH and RAWE Electronic GmbH, among others, have registered as exhibitors for this special showcase area.
The EMS Park also offers a small Speakers’ Corner where exhibitors can present their topics and solutions. The program as well as the presentations of the forums can be found at smtconnect.com/forum. This year, the exhibition forum also has a contribution to offer on the topic of EMS. Mr. Allois Mahr from Zollner Elektronik AG will give a lecture with the title: "Digital transformation in modern electronics production" on 7 May at 1:15 p.m.
In addition to the EMS Park, visitors will be offered the special showcase area "PCB meets Components" with exhibitors covering all aspects of printed circuit boards, components and materials. The Newcomer Pavilion will provide them with an overview of various newcomers to the industry and events and enable them to make valuable contacts.
The motto of this year's joint cluster stand is "Digitization and Robotics for the EMS Industry". The focus of this topic, which deals with the future of electronics manufacturing in Europe, will be the exchange of experience and discussions. The cluster joint stand 5-113 invites all visitors to a breakfast reception on Wednesday and Thursday from 9:30 to 10:30 a.m. While on Wednesday the focus will be on topics relating to purchasing and procurement, on Thursday the focus will be on organization and processes.
The "Future Packaging" production line organized by the Fraunhofer IZM in Hall 5, Booth 5-434, will be held in 2019 under the motto "Get In The Ring - Meeting the challenges of modern manufacturing". "The line aims to show visitors of the SMTconnect 2019 how maximum efficiency, process and technology robustness can be achieved with maximum flexibility. Each of our participants is aware of his responsibility towards his customers, interactively in close contact with them, to solve the tasks of the market", Mr. Ulf Oestermann from the Fraunhofer IZM summarizes this year's production line.
Visitors can experience all production steps "live" and discuss issues and challenges with experts. On its 1,000 square meters, the joint Future Packaging stand includes not only the production line but also a large number of co-exhibitors, supporters and sponsors.
At the annual hand soldering competition of the IPC - Association Connecting Electronics Industries from the USA, soldering professionals and young professionals will have the opportunity to demonstrate their skills on all three days of the exhibition. They compete against each other for the manual soldering of complex circuit boards and are evaluated primarily in terms of speed and precision.
The winner of the professional competition also wins a trip to the World Championship in Manual Soldering, which will take place in Munich in 2019.
SMTconnect will take place from 7 - 9 May 2019 in Nuremberg. Current information and the event tickets are available at smtconnect.com.
