Dialog Simplifies IoT Cloud Connectivity with Latest BLE Sensor Development Kit

Dialog Semiconductor unveiled its new 15 Degrees-of-Freedom (DOF) SmartBond Multi-Sensor Kit to support sensor connectivity in the Internet of Things (IoT). Built on Dialog’s DA14585 SmartBond System-on-Chip (SoC), the kit allows engineers to easily connect sensors to the cloud at the lowest power and smallest footprint.

Supporting more sensors than any other on the market, the kit allows developers to collect environmental data including temperature, pressure, humidity, gas concentrations, as well as motion, light, sound and magnetic field. This broad capability is especially suited to projects that require rapid prototyping and accelerated time-to-market. Operation and functionality can be easily tailored within its software to match the application, allowing it to be used as a beacon, tag, wireless sensor or mesh node. Additionally, software upgrades are accomplished remotely by utilizing the kit’s SUOTA (Software Upgrade Over The Air) functionality. Based on the SmartBond DA14585 SoC and powered by 2 AA batteries, the kit delivers long lasting battery life and a range of up to 300 meters (more info).