New XENSIV MEMS Microphones Enable Clear Voice Commands at Longer Distances

Mouser Electronics is now stocking IM69D120 and IM69D130 XENSIV™ MEMS microphones from Infineon Technologies. The high-performance, low-noise microphones are ideal for applications such as high-quality audio capture, voice user interface, active noise cancellation, or audio pattern detection in monitoring systems.

Infineon XENSIV microphones are designed for applications that require low self-noise, wide dynamic range, low distortion and a high acoustic overload point. The microphones incorporate Infineon's dual-backplate microelectromechanical systems (MEMS) technology to enable high linearity of the output signal within a dynamic range of up to 105 dB. The dual-backplate MEMS technology is based on a miniaturized symmetrical microphone design, similar as utilized in studio condenser microphones, which generates a truly differential signal. The technology allows improved high frequency immunity for better audio signal processing and increases the acoustic overload point of 10-percent total harmonic distortion (THD) to 135 dB SPL.

The 4 mm × 3 mm microphones feature a noise floor of just 25 dBA (69 dBA signal-to-noise ratio (SNR)), with distortion less than 1 percent, even at sound pressure levels of 128 dB SPL. The SNR is an improvement of 5 dB compared to a conventional MEMS microphone, essentially doubling the possible distance between a user and the device capturing a voice command.