As Europe´s leading platform for system integration in microelectronics, the SMT Hybrid Packaging is the ideal platform for exhibitors to present to a broad specialist public in an international environment. A total of 80 percent of the exhibition space has already been booked for the next exhibition in Nuremberg from 5 – 7 June 2018.
A range of significant national and international key players have already registered for the event in 2018. In 2017, a total of 35 percent of exhibitors came from abroad, predominantly from Switzerland, Great Britain and the Netherlands, once again reaffirming the event as the leading fair for system integration in microelectronics.
Companies exhibiting their products and solutions at the SMT Hybrid Packaging for the first time with the aim of wanting to get to know the event, have the opportunity to benefit from an attractive special offer. The Newcomer Pavilion joint stand offers first time exhibitors with a Full Service Package at cost-effective rates enabling them to test their fair presentation without having to spend too much time on the organization.
Alongside the Newcomer Pavilion, there is a range of further informative joint stands at the SMT Hybrid Packaging 2018, which showcase companies, products and services in the areas of PCB, EMS and optoelectronics. These are presented cost-effectively and with a special boost reaching a broad trade audience.
The joint stand “Mixed Double – PCB meets Components” hosts conductor boards, components and materials. The joint stand “EMS- Intersection” is a platform for contract manufacturers. Products and solutions for all aspects of optoelectronics can be found at the joint stand "Optics meets Electronics”.
With its extensive possibilities and offerings, the SMT Hybrid Packaging 2018 provides exhibitors an ideal opportunity to meet a competent audience of trade experts from manufacturing industries as well as decision-makers from around the world in electronic production and also present their products and solutions. Companies can receive information and request application documents at smthybridpackaging.com.
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