Akrometrix Launches New Warpage Metrology System

Akrometrix, LLC, the leading provider of thermal warpage and strain metrology equipment to both the front- and back-end semiconductor and electronics industries, is pleased to announce that it has launched its newest warpage metrology system – the Tabletop Shadow Moiré (TTSM) system.

“Over the years, many of our customers who are using our systems for thermal warpage metrology have stated a need for an ultra-fast, highly accurate room temperature warpage metrology system,” stated Mayson Brooks, Akrometrix President. “Additionally, they wanted a system that was small enough for a tabletop operation and that would allow them to utilize all the software features of our thermal warpage systems, only at room temperature.”

The TTSM meets this demand – enabling customers to measure warpage of substrates up to 300mm x 310 mm (a 300mm wafer or two JEDEC trays) with the entire measurement taking less than two seconds. Whether individual parts or a JEDEC tray of multiple parts, the TTSM provides an ultra-fast and highly accurate measurement at room temperature that is suited for tabletop use.

For more information about Akrometrix’s warpage metrology systems, please visit www.akrometrix.com.