Introducing Automotive-Qualified System-in-Package Hybrid MCU for Automotive and E-Mobility HMI Applications

Automotive and E-Mobility designers are incorporating more Human-Machine Interfaces (HMIs) with sophisticated graphics to enhance the user experience. To address the growing demand for HMI solutions, Microchip Technology announces the AEC-Q100 Grade 2-qualified, SAM9X75D5M System-in-Package (SiP) with an Arm926EJ-S™ processor and 512 Mbit DDR2 SDRAM. The SAM9X75D5M supports large display sizes up to 10 inches and XGA resolution of 1024 × 768 pixels.

The SAM9X75D5M is part of Microchip’s hybrid MCU family that enables users to capitalize on the advanced processing capabilities of a microprocessor (MPU) with access to embedded, higher memory densities while maintaining the familiar development environment of MCU-based designs, and the option to develop using Real-Time Operating Systems (RTOS). Tailored for automotive applications such as digital cockpit clusters, smart clusters for two- and three-wheelers, HVAC control, EV chargers and more, the SAM9X75D5M hybrid MCU SiP streamlines the development process by combining the MPU and memory into a single package. The device provides ample buffer space for automotive displays and offers flexible display interface options, including MIPI^® Display Serial Interface (DSI^®), Low Voltage Differential Signaling (LVDS) and RGB data in parallel.

With a simplified PCB layout, the SAM9X75D5M can reduce routing complexity and minimize discrete DRAM procurement risk and is built to support long-term availability and reliability (more info).

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