New DualPack 3 IGBT7 Modules Deliver High Power Density and Simplify System Integration

The growing need for compact, efficient and reliable power solutions is driving demand for power management devices that provide higher power density and simplify system design. Microchip Technology announces a new family of DualPack 3 (DP3) power modules featuring advanced IGBT7 technology available in six variants at 1200V and 1700V with high-current ranging from 300–900A. The new DP3 power modules are designed to address the growing demand for compact, cost-effective and simplified power converter solutions.

These modules use the latest IGBT7 technology, engineered to reduce power losses by up to 15–20% compared to IGBT4 devices and operate reliably at higher temperatures up to 175°C during overload. DP3 modules enhance protection and control during high-voltage switching, making them suitable for maximizing power density, reliability and ease of use in industrial drives, renewables, traction, energy storage and agricultural vehicles.

Available in a phase-leg configuration, the DP3 power modules in a compact footprint of approximately 152 mm × 62 mm × 20 mm, enable a frame size jump for increased power output (more info).

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