česky english June 16, 2024

3/2024 EN

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New AI accelerator for lightweight AI models and embedded processor technology to enable real-time processing

Fraunhofer IPMS develops new multi-sensor system for water analysis

How to work with the intelligent factory

Heatsink innovations for the printed circuit board

NXP breaks through integration barriers for software-defined vehicle development with open S32 CoreRide platform

New portfolios from TI push the limits of power design further, help engineers achieve industry-leading power density

Nexperia unveils next gen low-voltage analog switches

Nordson Electronics Solutions expands the SELECT® Synchro™ selective soldering equipment family with new Synchro 3 release

Samtec FireFly™ Micro Flyover System™ shipping for optical and copper designs to 28 Gbps

For safer roads: Bosch teams up with Microsoft to explore new frontiers with generative AI

Siglent delivers 12-bit oscilloscopes to address signal fidelity challenges on every bench

PolarFire® SoC Discovery Kit makes RISC-V and FPGA design more accessible for a wider range of embedded engineers

Si2-Series of acoustic imagers detect compressed air leaks, partial discharges, mechanical faults and quantify gas leaks

New Siemens software automatically identifies vulnerable production assets

Unveil the brand new GW Instek MPO-2000 series programmable oscilloscopes

ABB identifies new frontiers for robotics and AI in 2024

STMicroelectronics extends brand protection with NFC tags featuring state-of-the-art on-chip digital signature

ROHM develops a new operational amplifier that minimizes current consumption

The SMTconnect 2024: Increased synergy effects between electronics production and power electronics

New eBook offers expert perspectives on flexible manufacturing

Events calendar2024