Solido Simulation Suite provides customers order-of-magnitude faster verification for next-generation analog, mixed-signal and custom IC designs

Siemens Digital Industries Software introduced Solido™ Simulation Suite software (“Solido Sim” software), an integrated suite of AI-accelerated SPICE, Fast SPICE and mixed-signal simulators designed to help customers dramatically accelerate critical design and verification tasks for their next-generation analog, mixed-signal and custom IC designs.

Built on the foundation of Siemens’ industry-proven, foundry-certified Analog FastSPICE (AFS) platform, Solido Sim incorporates three innovative new simulators: Solido™ SPICE software, Solido™ FastSPICE software and Solido™ LibSPICE software, as well as Siemens’ market-proven AFS platform, ELDO™ software and Symphony™ software.

"Solido Simulation Suite, featuring AI-accelerated SPICE and FastSPICE engines, represents a significant leap forward in custom IC simulation technology, providing unmatched accuracy and efficiency for chip design and verification engineers,” said Michael Ellow, CEO, Silicon Systems, Siemens Digital Industries Software. "Our initial Solido Sim customers have experienced remarkable success across multiple processes technology platforms, all while demonstrating faster runtimes and enabling compelling new capabilities for their next-generation analog, RF, mixed-signal and library IP designs.”

Solido Sim is engineered to help IC design teams meet increasingly stringent specifications, verification coverage metrics and time-to-market requirements. It delivers comprehensive application coverage with best-in-class circuit and System-on-a-Chip (SoC) verification capabilities. Powered by AI technologies, Solido Sim is developed with next-generation process technologies and complex integrated circuit (IC) structures in mind, providing the required toolsets and capabilities to help achieve accurate signal and power integrity goals.

Solido Sim features a simplified use model, accelerated verification and a unified workflow. It delivers a compelling set of innovative new simulation technologies, including:

• Solido SPICE is Siemens’ next-generation, feature-rich SPICE simulation technology, providing a 2-30x speedup for analog, mixed-signal, RF and 3D IC verification. With newer convergence, cache efficient algorithms and high multi-core scalability, Solido SPICE provides a significant performance boost for large pre- or post-layout designs. RF IC developers can directly benefit from Solido SPICE’s new RF verification capabilities, while multi-die, 2.5D, 3D and memory interface developers can now experience an efficient capability for full channel transceiver verification that include sequalization, drastically reducing interface assumptions and accelerating verification.
• Solido FastSPICE is Siemens’ cutting-edge Fast SPICE simulation technology, providing an order-of-magnitude speedup for SoC, memory and analog functional verification. It provides a dynamic use model for SPICE-to-Fast SPICE scaling, providing a scalable interface to help achieve speed goals with predictable accuracy. Solido FastSPICE includes multi-resolution technology for differentiated performance and SPICE-accurate waveforms during critical path analysis for memory and analog characterization.
• Solido LibSPICE is Siemens’ purpose-built batch solver technology for small designs, providing optimized runtimes for Library IP applications. Solido LibSPICE is uniquely integrated into Siemens’ popular Solido Design Environment and Solido Characterization Suite offerings for performance acceleration, enabling a full-flow solution for seamless and robust verification of standard cells and memory bit-cells.

Powering all 3 of these new solvers is Solido Sim AI – the latest version of Siemens’ groundbreaking, AI- accelerated simulation technology. Solido Sim AI is the newest iteration of the AI technology that Solido Design Automation used to pioneer the design and deployment of AI for EDA purposes 15 years ago. With Solido Sim AI, circuit simulation is advanced to the next level with algorithms that are self-verifying and tuned to SPICE accuracy, providing orders-of-magnitude improved acceleration – all accomplished using existing foundry-certified device models without alteration.

Solido Sim integrates natively within Siemens Solido™ Design Environment and Solido™ Characterization Suite, offering customers superior performance with optimal accuracy, improved productivity, and scalability across cloud infrastructures. Further, Solido Simulation Suite works closely with Siemens’ industry leading IC sign-off flows Calibre® platform Design solutions and Tessent™ Test solutions as well as Siemens’ electronic systems design and manufacturing PCB solutions, providing full-flow verification solutions across applications.

To learn more, visit https://eda.sw.siemens.com/en-US/ic/solido/

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